PURPOSE: To prevent the bonding failure causedly by corroded pad by a method wherein color separation filters are positioned on a passivation film and are provided with openings wherein pads are installed and the passivation film exposed in said openings is removed by etching when bonding pads are formed in the passivation film formed on a solid state image pickup element.
CONSTITUTION: Regions 22, 23, 24 and others that are necessary for CCD functioning are formed on an Si substrate 21 and the entire surface is covered with an interlayer insulating film 25, wherein a contact hole 26 is provided. At the same time, a part along a dicing line 27 is removed. Next, the entire surface is covered with an Al film that is evaporated in vacuum, and pattering is conducted wherein an end comes in contact with the region 23 through the contact hole 26. The other end is formed into a wiring spreading on the film 25 to work as a bonding pad 28. A film 25 including the pads 28 is covered with a PSG made passivation film 29. After this, the film 29 is removed from over the pad 28. In this process, different color filters 301∼304 are arranged across the entire surface and provided with openings, and then film 29 exposed in the openings is removed by etching.
| JPS61174763 | SOLID IMAGE SENSOR DEVICE |
HAYASHIMOTO YOSHIAKI
YOSHIDA OKIO
