Title:
MANUFACTURE OF SURFACE ACOUSTIC WAVE ELEMENT
Document Type and Number:
Japanese Patent JPS6148984
Kind Code:
A
Abstract:
PURPOSE:To cut a electrode surface of a surface acoustic wave element in a short time without damaging, by a method wherein a wafer is cut to plural number of elements using a cutting jig after it is engraved a groove by a laser scriber. CONSTITUTION:The upper surface of a wafer mounting rack 13 is covered with a thin vinyl sheet. A wafer 15 which is coated with passivation film beforehand at the electrode surface of the surface acoustic wave element, is mounted on the wafer mounting rack 13 so that the surface on which grooves are engraved by a laser scriber, contact to the vinyl sheet, and is secured by an adhesive tape. A cutter blade 19 is lowered by rotating knobs 12 and 14, and when the blade 19 and the wafer 15 contact, the blade is controlled so as to blade line of the blade 19 and the cutting line on which the engraved groove on the wafer is represented to the opposite surface are lined up. After this, the blade 19 is lowered by pushing a blade pushing element 18, and the blade 19 is pressed from the back side of the wafer 15 coinciding with the groove which is engraved by the laser scriber.
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Inventors:
SAKAI ATSUSHI
Application Number:
JP17047884A
Publication Date:
March 10, 1986
Filing Date:
August 17, 1984
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L41/338; B23K26/00; H01L21/301; H01L21/78; H01L41/22; H01L41/39; (IPC1-7): B23K26/00; H01L21/78; H01L41/22
Attorney, Agent or Firm:
Kimura Saburo