Title:
MANUFACTURE FOR SWITCH
Document Type and Number:
Japanese Patent JPH05166431
Kind Code:
A
Abstract:
PURPOSE: To reduce the cost of mounting a part without a trouble of a switch due to remaining solder between a surface of a switch pattern and the end of a contact piece, in the case of manufacturing the switch comprising the switch pattern provided on a printed board and the contact piece possible to come into contact with the concerned switch pattern.
CONSTITUTION: In a method for manufacturing a switch comprising a switch pattern 2 provided on a printed board 1 and a contact piece 4 possible to come into contact with the switch pattern 2, carbon printing 9 is applied to the switch pattern 2 before dip-soldering the printed board 1.
Inventors:
SEKIDO KEIZO
MATSUMURA NAOKI
MATSUMURA NAOKI
Application Number:
JP35068291A
Publication Date:
July 02, 1993
Filing Date:
December 12, 1991
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
H01H11/00; H01H11/04; H01H11/06; H05K3/34; H05K3/40; (IPC1-7): H01H11/00; H01H11/04; H01H11/06
Attorney, Agent or Firm:
Kazuyuki Hirayama (1 person outside)