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Patent Searching and Data


Title:
MANUFACTURE OF THICK FILM CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPS6457795
Kind Code:
A
Abstract:

PURPOSE: To accurately form a crossover insulating layer on the periphery of a soldering electrode land by forming an insulating layer simultaneously with a crossover region on the peripheral region near at least the crossover region of a soldering electrode land which is disposed near at least the crossover region.

CONSTITUTION: First crossover glass paste is printed on a crossover region 4 and the part of the periphery of a soldering electrode land 3, dried and baked to form a first crossover insulating layer 5. Part of a first wiring conductor film 2 is covered with the layer 5 and the periphery of the region near the crossover region 4 of the land 3 is also covered therewith. Accordingly, it operates as the function of a solder resist layer. When the paste for forming the layer 5 is printed, the rugged part of the region near the land 3 is small. Thus, squeegee is in close contact with a substrate 1, and an accurate pattern is printed with less sag to prevent the paste from adhering to the land 3.


Inventors:
TSUMITA YOSHIYUKI
OKI NOBORU
SAIKI TAKASHI
Application Number:
JP21437487A
Publication Date:
March 06, 1989
Filing Date:
August 28, 1987
Export Citation:
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Assignee:
TAIYO YUDEN KK
International Classes:
H05K3/46; H05K3/28; H05K3/40; (IPC1-7): H05K3/46
Domestic Patent References:
JPS61110490A1986-05-28
JPS56132778U1981-10-08
JPS51149558A1976-12-22
JPS50117365U1975-09-25
Attorney, Agent or Firm:
Takano Noritsuji