PURPOSE: To prevent a reaction preventing film from being peeled by executing annealing treatment to a magnetic circuit part, which is composed of a multi- layer thin film, at a higher temperature than a glass fusing temperature in advance before the reaction preventing film is formed.
CONSTITUTION: Before a reaction preventing film 12 is formed, the annealing is executed to a substrate 1, in which magnetic circuit parts 2W10 are formed, at the higher temperature than the glass fusing temperature and after that, the reaction preventing film 12 is adhered and formed. Then, a protecting plate 14 is glass-fused. Accordingly, gas in a multi-layer film and gas, which is generated due to a residual organic substrate is gasified, are discharged out of the film without being remained. Thus, there is no danger that the gas is generated when the protecting board 14 is glass-fused. Thus, the reaction preventing film can be prevented from being peeled.
Wada, Yoshitaka
Sato, Kazunori
Onuma, Hiroshi
