PURPOSE: To cope with a greatly protruding and recessed three-dimensional molded body by a method wherein a primary molded body is formed by using a phenol resin, this primary molded body and a printed-circuit board are piled up and are loaded in a compression-molding metal mold and both are united by a heating and pressurization operation.

CONSTITUTION: A phenol resin is used and a primary molded body 1, of a prescribed three-dimensional shape, in which the phenol resin has not been hardened completely is obtained. A printed-circuit board 3 and the primary molded body 1 are piled up and are loaded in a compression-molding metal mold; both are molded integratedly by a heating and pressurization operation in such a way that the printed-circuit board 3 follows a shape of the primary molded body 1. In this case, the phenol resin is hardened completely during this compression molding operation. By this hardening reaction, the phenol resin is reacted also with an epoxy resin which constitutes an insulating board of a printed circuit; they are bonded physically as well as chemically. The printed-circuit board 3 and the molded body 1 can be firmly integrated.