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Title:
MANUFACTURING METHOD FOR BORED POROUS RESIN BASE MATERIAL AND POROUS RESIN BASE MATERIAL HAVING CONDUCTIVE BORED INNER WALL SURFACE
Document Type and Number:
Japanese Patent JP2005046993
Kind Code:
A
Abstract:

To provide a manufacturing method for a bored porous resin base material capable of accurately forming bores (through hole) with smooth edges at the necessary positions of the porous resin base material without producing the rupture of a porous structure, deformation of the base material, and burrs and a porous resin base material having bored inner wall surface selectively made conductive.

This manufacturing method for the bored porous resin material comprises a step 1 for impregnating a liquid or a solution in the porous structure of the porous resin base material, a step 2 for forming a solid matter from the impregnated liquid or solution, a step 3 for forming the plurality of bores extending from the first surface and passed through the second surface of the porous resin base material having the solid matter in the porous structure, and a step 4 for removing the solid matter from the inside of the porous structure by fusing or dissolving the solid matter. A method of manufacturing the porous resin base material having the conductive bore inner wall surface comprises a step of selectively adhering a catalyst only to the inner wall surfaces of the bores and adhering a conductive metal to the inner wall surfaces.


Inventors:
FUJITA TARO
OKUDA YASUHIRO
HAYASHI FUMIHIRO
HAGA TAKESHI
UENOYAMA MASAYO
MASUDA YASUHITO
IDOMOTO YUICHI
Application Number:
JP2004166956A
Publication Date:
February 24, 2005
Filing Date:
June 04, 2004
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B23B41/00; B29C67/20; C08J9/36; H01R11/01; H01R43/00; (IPC1-7): B23B41/00; B29C67/20; C08J9/36; H01R11/01; H01R43/00
Domestic Patent References:
JP2004265844A2004-09-24
JPH08506777A1996-07-23
JPH07501988A1995-03-02
JPS48174B1
Attorney, Agent or Firm:
Shigeaki Nishikawa