Title:
回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
Document Type and Number:
Japanese Patent JP5163789
Kind Code:
B2
Abstract:
The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.
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Inventors:
Yasuhiro Arifu
Mochizuki Hiomi
Koji Kobayashi
Takashi Nakazawa
Takashi Tachizawa
Katsuyuki Masuda
Takako Ejiri
Mochizuki Hiomi
Koji Kobayashi
Takashi Nakazawa
Takashi Tachizawa
Katsuyuki Masuda
Takako Ejiri
Application Number:
JP2011173158A
Publication Date:
March 13, 2013
Filing Date:
August 08, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J7/00; H01R11/01; C09J9/02; C09J11/04; C09J157/08; C09J163/00; C09J179/08; C09J201/04; H01B5/16; H05K1/14; H05K3/36
Domestic Patent References:
| JP2006127956A | ||||
| JP2005347273A |
Foreign References:
| WO2007046190A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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