To provide a silver compound metal powder suitable for fine wiring and formation of electrical contact points, and excellent in low-temperature baking characteristics in an atmosphere.

The compound metal powder consists of silver particles and particles of metal X other than the silver whose standard electrode potential E0is 0.80 V or higher, with average particle size (DTEM) as 20 nm or smaller while crystal particle size (Dx) as 20nm or smaller. It consists of compound particles including a mixed mode of silver particle and metal X particle, a mode in alloy particle of silver and metal X, a mode in core-shell structure with silver as a core and metal X as shell, a mode of core-shell structure with metal X as core and silver as shell, a carrying mode in which silver particle carries metal X particle, or carrying mode in which metal X particle carries silver particle.

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