Title:
化合物半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5212202
Kind Code:
B2
Inventors:
Yuichi Minoura
Kenji Imanishi
Naoya Okamoto
Kenji Imanishi
Naoya Okamoto
Application Number:
JP2009067842A
Publication Date:
June 19, 2013
Filing Date:
March 19, 2009
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/3063; H01L21/337; H01L21/338; H01L29/778; H01L29/808; H01L29/812; H01S5/343
Domestic Patent References:
| JP2007536732A | ||||
| JP200660200A | ||||
| JP2003158113A |
Attorney, Agent or Firm:
Junichi Yokoyama