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Title:
銅合金材の製造方法及びその装置
Document Type and Number:
Japanese Patent JP5053242
Kind Code:
B2
Abstract:
A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni-Cu mother alloy, a Co-Cu mother alloy, an Si-Cu mother alloy, a Ni-Si-Cu mother alloy, and a Co-Si-Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.

Inventors:
Koichi Yoshida
Takasawa Tsukasa
Toshiro Abe
Shuji Tomimatsu
Application Number:
JP2008302814A
Publication Date:
October 17, 2012
Filing Date:
November 27, 2008
Export Citation:
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Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
B22D11/108; B22D1/00; B22D11/00; B22D11/059; B22D11/06; B22D11/117; B22D21/00; B22D39/06; F27D27/00
Domestic Patent References:
JP2006341268A
JP38537A
JP6362830A
Attorney, Agent or Firm:
Toshizo Iida
Wataru Sasaki
Naosuke Miyamae



 
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