Title:
電子部品実装モジュールの製造方法
Document Type and Number:
Japanese Patent JP5844439
Kind Code:
B2
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Inventors:
Chen Jin
Zheng Zong Sakae
Liu Kasei
Zheng Zong Sakae
Liu Kasei
Application Number:
JP2014156811A
Publication Date:
January 20, 2016
Filing Date:
July 31, 2014
Export Citation:
Assignee:
UNIVERSAL SCIENTIFIC INDUSTRIAL(SHANGHAI)CO.,LTD
International Classes:
H01L23/28; H01L21/56; H01L23/00; H01L23/29; H01L23/31; H01L25/04; H01L25/18; H05K3/28; H05K9/00
Domestic Patent References:
| JP2007059846A | ||||
| JP2012159935A |
Foreign References:
| WO2012023332A1 |
Attorney, Agent or Firm:
Hideno Kono
Nobuo Kono
Nobuo Kono