Title:
電子装置の製造方法
Document Type and Number:
Japanese Patent JP7069297
Kind Code:
B2
Abstract:
The method for manufacturing an electronic device of the present invention includes at least: a step (1) of preparing a structure (100) provided with an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and for temporarily fixing an electronic component (70), and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and in which an adhesive force is decreased by an external stimulus, an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80) attached to the adhesive resin layer (B) of the adhesive film (50) ; at least one step (2) selected from a step (2-1) of decreasing water content in the adhesive film (50) and a step (2-2) of decreasing water content in the structure (100); and a step (3) of sealing the electronic component (70) with a sealing material (60).
Inventors:
Koji Igarashi
Kinoshita Hitoshi
Hiroyoshi Kurihara
Toru Miura
Kinoshita Hitoshi
Hiroyoshi Kurihara
Toru Miura
Application Number:
JP2020510722A
Publication Date:
May 17, 2022
Filing Date:
March 19, 2019
Export Citation:
Assignee:
Mitsui Chemicals Tohcello Co., Ltd.
International Classes:
H01L21/56; C09J7/38; C09J133/04; C09K3/10; H01L23/12
Domestic Patent References:
| JP2007027623A | ||||
| JP2011134811A | ||||
| JP2004128337A |
Foreign References:
| WO2017170452A1 | ||||
| WO2015029871A1 |
Attorney, Agent or Firm:
Shinji Hayami