Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP5380800
Kind Code:
B2
Abstract:
An electronic component (1) includes a substrate (10), an interconnection element (102), and a connector (100). The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base (101), at least one stopper (17), and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface (103).
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Inventors:
Atsuo Hattori
Application Number:
JP2007183494A
Publication Date:
January 08, 2014
Filing Date:
July 12, 2007
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
H01L23/32; H01L21/60; H01R12/71
Domestic Patent References:
| JP2007128798A | ||||
| JP2002008805A | ||||
| JP2001160443A | ||||
| JP2072642A | ||||
| JP10255932A | ||||
| JP2000068017A | ||||
| JP2009530797A |
Attorney, Agent or Firm:
knowledge partners Patent business corporation
Dai Yoshida
Wataru Iwakami
Dai Yoshida
Wataru Iwakami
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