Title:
MANUFACTURING METHOD OF HOLDING DEVICE
Document Type and Number:
Japanese Patent JP2017174853
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress occurrence of exfoliation on the interface, or the like, of a bonding layer and a member to be bonded, in a holding device.SOLUTION: A holding device includes a ceramic plate, a composite plate formed of a composite material of ceramic and a first aluminum alloy having a solid phase line temperature Ts1 (°C) and a liquid phase line temperature Tl1 (°C), and a bonding layer for bonding the ceramic plate and composite plate. A manufacturing method of a holding device includes a step of preparing a foil material of the second aluminum alloy having a solid phase line temperature Ts2 (°C) (Ts2≤Ts1-40), a step of placing the foil material between the ceramic plate and composite plate, and a step of forming a bonding layer by heating the ceramic plate and composite plate and foil material, while compressing, in a temperature range between a lower limit temperature Tmin (Tmin=Ts1-30) and an upper limit temperature Tmax (Tmax is lower one of Ts1+30 and Tl1), thereby melting at least a part of the foil material.SELECTED DRAWING: Figure 4
Inventors:
TSUJI MASAKI
TOSA AKIBUMI
TOSA AKIBUMI
Application Number:
JP2016055942A
Publication Date:
September 28, 2017
Filing Date:
March 18, 2016
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
H01L21/683; B23K1/00; B23K1/19; C04B37/02
Attorney, Agent or Firm:
Patent Business Corporation Alpha International Patent Office