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Title:
発光装置の製造方法
Document Type and Number:
Japanese Patent JP5961148
Kind Code:
B2
Abstract:
Provided is a method of manufacturing a light-emitting device, the method including: a step of providing a conductive material on both surfaces of a base material in which a plurality of light-emitting elements each including a first electrode and a second electrode facing each other are formed, and cutting out the light-emitting elements together with the conductive material from the base material, to thereby obtain the light-emitting elements in each of which the first electrode and the second electrode are provided with conductive members having substantially the same sizes as those of the first electrode and the second electrode; a step of mixing the light-emitting elements with a binder having an insulating property to obtain a coating liquid, and applying the coating liquid onto a first substrate having a conductive layer formed thereon, to thereby form a coating layer; a step of laminating a second substrate having a conductive layer formed thereon on the first substrate so that the coating layer is interposed between the first and second substrates; and a step of applying pressure in a lamination direction in which the first substrate and the second substrate are laminated on each other, and holding the substrates at a preset temperature for a preset period of time in a state where the pressure is applied.

Inventors:
Yuhisa Usami
Application Number:
JP2013161599A
Publication Date:
August 02, 2016
Filing Date:
August 02, 2013
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
H01L33/54; F21S2/00; H01L33/62; H01L51/50; H05B33/02; H05B33/04; H05B33/10; H05B33/14; H05B33/26
Domestic Patent References:
JP2008525206A
JP2008141026A
JP2011134926A
JP2007531321A
Foreign References:
WO2012031178A2
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi



 
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