Title:
変性ポリアミドエポキシ樹脂の製造法
Document Type and Number:
Japanese Patent JP3601553
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a production process for a modified polyamide resin having high adhesion and high heat resistance and an adhesive and an adhesive film which give sufficient adhesion strength even in the contact bonding at low temperature and have excellent chemical resistance, soldering heat resistance and processability. SOLUTION: (I) An acid terminal polyamide is prepared by reaction of (A) dicarboxylic acids containing (a) a both terminal carboxylic acid compound having a polyalkylene glycol residue or a polycarbonate diol residue and (b) an aliphatic or aromatic polycarboxylic acid with (B) an organic diisocyanate at a molar ratio of the carboxyl groups/the isocyanate groups of > 1. This acid terminal polyamide resin (I) is allowed to react with (II) an epoxy resin at a molar ratio of" epoxy groups/carboxyl groups of >=1 to prepare a modified polyamide epoxy resin. The modified polyamide epoxy resin thus obtained, an epoxy resin and an epoxy resin curing agent are reacted to give the objective adhesive and adhesive film.
Inventors:
Takao Hirayama
Toshihiko Ito
Yoshiyuki Mukaiyama
Hiroaki Hirakura
Hiroshi Nishizawa
Ken Nanami
Kiyoshi Hirosawa
Toshihiko Ito
Yoshiyuki Mukaiyama
Hiroaki Hirakura
Hiroshi Nishizawa
Ken Nanami
Kiyoshi Hirosawa
Application Number:
JP22404195A
Publication Date:
December 15, 2004
Filing Date:
August 31, 1995
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G18/42; C08G18/44; C08G18/48; C08G59/02; C08G59/14; C08G59/20; C08G69/48; C08G59/44; C08L63/00; C09J163/00; H05K3/38; (IPC1-7): C08G59/02; C08G59/20
Domestic Patent References:
| JP8193119A | ||||
| JP5295081A | ||||
| JP5051571A | ||||
| JP5051447A | ||||
| JP2022319A |