Title:
実装構造体の製造方法
Document Type and Number:
Japanese Patent JP6718106
Kind Code:
B2
Abstract:
A manufacturing method of a mounting structure, the method including a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a first cured layer; a removal step of removing the thermoplastic sheet from the first cured layer; and a coating film formation step of forming a coating film on the first cured layer, after the removal step. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.
Inventors:
Eiichi Nomura
Yutaka Miyamoto
Suguru Hashimoto
Yutaka Miyamoto
Suguru Hashimoto
Application Number:
JP2019559208A
Publication Date:
July 08, 2020
Filing Date:
December 13, 2018
Export Citation:
Assignee:
Nagase Chemtex Co., Ltd.
International Classes:
H01L21/56; H01L23/00; H01L23/08; H01L23/29; H01L23/31; H03H3/08; H03H9/25
Domestic Patent References:
| JP2015106573A | ||||
| JP201553470A | ||||
| JP2015221499A | ||||
| JP200898419A | ||||
| JP201792103A | ||||
| JP2015179814A | ||||
| JP2017108183A | ||||
| JP2004327623A |
Attorney, Agent or Firm:
Kawasaki/Hashimoto Patent Office