To propose a manufacturing method permitting the efficient manufacture of a multilayer wiring board and an improvement in the reliability of interlayer conduction connection of a stacked via or the like.

In an insulating resin substrate 1, there is formed a via hole 2 having the maximum diameter that is twice or less the thickness of a wiring conductor to be formed. In the insulating resin substrate with the via hole formed, a base metal layer 3 and a resist film 4 are formed. An electrolytic plating metal 5 is deposited by electrolytic plating to form a wiring conductor of a predetermined thickness and fill the via hole conductor at the same time. By stacking a predetermined kind and number of single-layer wiring boards 6 obtained in this way to press them, a multilayer wiring board is formed.

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