Title:
無収縮多層セラミック基板の製造方法
Document Type and Number:
Japanese Patent JP4881975
Kind Code:
B2
Abstract:
Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.
Inventors:
Cho, Bomb Jun
Park, Yunte
Kim, Hyun Ho
Park, Yunte
Kim, Hyun Ho
Application Number:
JP2009134442A
Publication Date:
February 22, 2012
Filing Date:
June 03, 2009
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H05K3/46
Domestic Patent References:
| JP2008004733A | ||||
| JP2006269692A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation