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Title:
有機ELデバイスの製造方法
Document Type and Number:
Japanese Patent JP6872586
Kind Code:
B2
Abstract:
To provide an organic EL device having a thin film sealing structure having a relatively thin organic barrier layer and improved production efficiency and moisture resistance reliability, and provide a manufacturing method thereof.SOLUTION: In an organic EL device 100, when viewed from the normal direction of a substrate 1, an organic planarization layer 2Pb is formed in a region where an inorganic protective layer 2Pa is formed, and an organic EL element 3 is arranged in a region where the organic planarization layer is formed, the outer edge of a TFE structure 10 intersects with a lead-out wiring, and in a portion that exists between the outer edge of the organic planarization layer and the outer edge of the inorganic protective layer and where the inorganic protective layer and a first inorganic barrier layer 12 are in direct contact with each other on the lead-out wiring, the taper angle of the side surface in the cross-sectional shape of the first inorganic barrier layer parallel to the line width direction of the lead-out wiring is less than 90°. A manufacturing method of the organic EL device does not include a step of heating the organic planarization layer before a step of forming an organic EL element layer after the formation of the organic planarization layer.SELECTED DRAWING: Figure 1

Inventors:
Yozo Narutaki
Katsuhiko Kishimoto
Application Number:
JP2019139891A
Publication Date:
May 19, 2021
Filing Date:
July 30, 2019
Export Citation:
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Assignee:
Sakai Display Products Co., Ltd.
International Classes:
H05B33/10; G09F9/30; H01L27/32; H01L51/50; H05B33/02; H05B33/04; H05B33/06; H05B33/22
Domestic Patent References:
JP2015173078A
JP2017068927A
JP2004047410A
JP2002057162A
JP2011049549A
JP2005327708A
Foreign References:
KR1020160056487A
WO2015178059A1
Attorney, Agent or Firm:
Seiji Okuda
Osamu Kita
Ryoji Yamashita
Akiko Miyake
Murase Nariyasu
Rinko Kita