Title:
MANUFACTURING METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2022098063
Kind Code:
A
Abstract:
To form a plating uniformly even if there is eccentricity in through hole arrangement density.SOLUTION: A plurality of first penetration holes 4-1 are formed at a first pitch on a double-sided copper clad laminated board 3. A first plating film is formed on a first copper foil; a second plating film is formed on a second copper foil; and a first through hole conductor 5-3 is formed within the plurality of first penetration holes 4-1. A surface of the first copper foil and the second copper foil is made flush with a surface of the first through hole conductor 5-3 by polishing or etching, and a plurality of second penetration holes 4-2 are formed at a second pitch with respect to the adjacent first penetration holes. A third plating film and a fourth plating film are formed on the flush surfaces of the copper foils and the first through hole conductor 5-3, and a second through hole conductor 5-6 is formed within the plurality of second penetration holes 4-2. The surface of the copper foils is made flush with a surface of the first through hole conductor 5-3 and the second through hole conductor 5-6 by polishing or etching and thereafter, a first conductor circuit 8-1 and a second conductor circuit 8-2 are formed from a fifth plating film and a sixth plating film which are formed on both the surfaces.SELECTED DRAWING: Figure 1F
Inventors:
HASEGAWA TAKAHIDE
Application Number:
JP2020211387A
Publication Date:
July 01, 2022
Filing Date:
December 21, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/40
Attorney, Agent or Firm:
Ginza Marronnier Patent Office
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