Title:
樹脂封止装置及び樹脂成形品の製造方法
Document Type and Number:
Japanese Patent JP6491508
Kind Code:
B2
Abstract:
Resin sealing apparatus and method of sealing a substrate. A lower mold (18) facing an upper mold (13) has a bottom surface member (22) for a cavity and a side surface member (23) for the cavity. An upper end surface of the bottom surface member (22) forms an inner bottom surface of the cavity (24) and has a planar shape corresponding to an unusual planar shape of a sealing resin (R2). The side surface member (23) and the bottom surface member (22) can slide relatively. A substrate (19) is disposed on a mold surface of the upper mold (13) such that a component (19a) to be sealed attached to the substrate (19) faces downward, and the cavity (24) is filled with a fluid resin (R1). The upper mold (13) and the lower mold (18) are clamped, and the component (19a) to be sealed is immersed in the fluid resin (R1) filled into the cavity (24). Then, the bottom surface member (22) is raised, and the fluid resin (R1) within the cavity (24) is pressed at a prescribed resin pressure and cured to form the sealing resin (R2). The bottom surface member (22) and the side surface member (23) are moved relatively, and thereby, a molded product (M) having the sealing resin (R2) is released from a mold surface of the lower mold (18).
Inventors:
Yohei Onishi
High-definition
High-definition
Application Number:
JP2015059711A
Publication Date:
March 27, 2019
Filing Date:
March 23, 2015
Export Citation:
Assignee:
towa corporation
International Classes:
H01L21/56; B29C43/18; B29C43/34; B29C43/36
Domestic Patent References:
| JP2012061728A | ||||
| JP2012126074A | ||||
| JP2013247315A | ||||
| JP2003174052A | ||||
| JP2013184413A | ||||
| JP2006157051A | ||||
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