Title:
半導体封止用樹脂タブレットの製造方法および樹脂成形体の製造方法
Document Type and Number:
Japanese Patent JP4569296
Kind Code:
B2
Inventors:
Baba Shoji
Kenji Takayama
Kota Ashikari
Kenji Takayama
Kota Ashikari
Application Number:
JP2004381793A
Publication Date:
October 27, 2010
Filing Date:
December 28, 2004
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B29B9/08; B29B11/06; H01L21/56
Domestic Patent References:
| JP5152363A | ||||
| JP2003105094A | ||||
| JP10041327A | ||||
| JP6104301A | ||||
| JP2003025325A | ||||
| JP11333835A |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi