To provide a manufacturing method of a semiconductor device which can manufacture the semiconductor device having excellent connection dependability when a high-temperature and high-humidity test and a temperature cycling test are performed.
A manufacturing method of a flip-chipped semiconductor device comprises the steps of: pasting adhesive for circuit member connection to a semiconductor wafer and obtaining a laminate; fixing the laminate on a dicing tape and cutting it into a unit piece; and obtaining a unit piece of semiconductor chip with the adhesive for circuit member connection by picking up from the dicing tape. The adhesive for circuit member connection contains phenolic compound having phenolic hydroxyl group, thermosetting resin, thermoplastic resin, and stiffening agent for the thermosetting resin.
TAKEMURA KENZO
NAGAI AKIRA
WATANABE OSAMU
SATO SHIN
| JP2009073872A | 2009-04-09 | |||
| JP2003338580A | 2003-11-28 | |||
| JP2010010368A | 2010-01-14 |
| WO2009069783A1 | 2009-06-04 | |||
| WO2008084811A1 | 2008-07-17 |
Yoshinori Shimizu
Tomoya Furoshita
Junichiro Sakamaki
Next Patent: ADHESIVE AND BINDER FOR ELECTRO-OPTIC DISPLAY