To provide a flattening method for a semiconductor device having good flattening performance and polishing speed for long hours, without changing a surface state of a polishing pad all the time.
In order to make the uniformity of step flatness and in-surface polishing amount compatible by using a hard and unfoamable polishing pad, this polishing device is provided with a precision machining mechanism for cutting and grinding, capable of forming a smooth pad surface and a groove for efficiently carrying slurry to an interface between the pad and a wafer on a rotating surface plate. Therefore, high flatness and a uniform polishing speed can be obtained for long hours. Consequently, by preventing defocusing in an exposure process, high precision resolution can be obtained, so that the high reliability and integration of the semiconductor device can be promoted.
KOJIMA HIROYUKI
OKAWA TETSUO
