Title:
Manufacturing method of semiconductor device
Document Type and Number:
Japanese Patent JP6009192
Kind Code:
B2
Inventors:
Takaaki Kodaira
Katsuhito Sasaki
Yuki Doi
Ujio
Minako Oritsu
Katsuhito Sasaki
Yuki Doi
Ujio
Minako Oritsu
Application Number:
JP2012076406A
Publication Date:
October 19, 2016
Filing Date:
March 29, 2012
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L21/76
Domestic Patent References:
| JP2012009489A | ||||
| JP11135609A | ||||
| JP2003110015A | ||||
| JP11354626A | ||||
| JP2003309108A | ||||
| JP2003017555A | ||||
| JP5275527A | ||||
| JP61054641A |
Attorney, Agent or Firm:
Minoru Maeda
Youichi Yamagata
Masahiko Shinohara
Youichi Yamagata
Masahiko Shinohara
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