Title:
Manufacturing method of semiconductor device
Document Type and Number:
Japanese Patent JP6011373
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To appropriately achieve both partial exposure of a semiconductor chip and protection of the exposed part with a resin, in a semiconductor device in which a part of the semiconductor chip is sealed with the resin.SOLUTION: There is provided a method of manufacturing a semiconductor device comprising a resin 20 for sealing a first portion 1 of a plate-like semiconductor chip 10, and in which a second portion 2 of the semiconductor chip 10 is exposed from the resin 20, and a part of the resin 20 is configured as an opposed wall opposed to lateral faces 14-16 in the second portion 2 via a gap. By filling with the resin 20 in a state that a film is adhered to both plate surfaces 11 at the second portion 2 via a mold, resin sealing is performed so that both plate surfaces at the second portion 2 are exposed. Thereafter, the resin 20 located on the lateral faces 14-16 at the second portion 2 is irradiated with a laser beam L to remove a part of the resin 20 so as to form the gap, and thereby, the opposed wall is formed.
Inventors:
Hiroshi Hashimoto
Takao Iwaki
Yoshifumi Watanabe
Takashi Kinnan
Takao Iwaki
Yoshifumi Watanabe
Takashi Kinnan
Application Number:
JP2013017183A
Publication Date:
October 19, 2016
Filing Date:
January 31, 2013
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/56; B23K26/00; B23K26/36
Domestic Patent References:
| JP2011119500A | ||||
| JP2013016686A | ||||
| JP2002350387A | ||||
| JP2011122984A |
Foreign References:
| WO2009069577A1 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office
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