Title:
Manufacturing method of semiconductor device
Document Type and Number:
Japanese Patent JP6194394
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method using an adhesive composition, an adhesive film and an attachment method which enable easy separation of a wafer and a support medium.SOLUTION: A semiconductor device manufacturing method comprises a process of separating a wafer and a support medium of the wafer by swelling an adhesive layer for adhering the wafer and the support medium of the wafer without dissolution by a solvent, in which the adhesive layer is formed by using an adhesive composition which contains elastomer equal to or larger than 40 wt%, which includes a styrene unit as a constituent unit of a main chain and content of the styrene unit is larger than 50 wt% and not more than 90 wt% and a weight-average molecular weight of the elastomer is not less than 10,000 and not more than 200,000.SELECTED DRAWING: None
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Inventors:
Hiroshi Imai
Toshiyuki Ogata
Kubo Antsushi
Takahiro Yoshioka
Takuya Noguchi
Toshiyuki Ogata
Kubo Antsushi
Takahiro Yoshioka
Takuya Noguchi
Application Number:
JP2016149005A
Publication Date:
September 06, 2017
Filing Date:
July 28, 2016
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
H01L21/304; C09J5/00; C09J7/02; C09J153/02; H01L21/683
Domestic Patent References:
| JP2010183014A | ||||
| JP2010235771A |
Attorney, Agent or Firm:
Harakenzo world patent & trademark