Title:
Manufacturing method of semiconductor devices
Document Type and Number:
Japanese Patent JP6316708
Kind Code:
B2
Abstract:
Provided is a method for manufacturing a semiconductor device that can achieve downsizing of the semiconductor device. Convex portions are pressed against side surfaces other than one side surface of one chip mounting portion, thereby fixing the chip mounting portion without forming a convex portion corresponding to the one side surface of the chip mounting portion. Likewise, convex portions are pressed against side surfaces other than one side surface of the other chip mounting portion, thereby fixing the other chip mounting portion without forming a convex portion corresponding to the one side surface of the other chip mounting portion.
Inventors:
Koji Bando
Application Number:
JP2014171597A
Publication Date:
April 25, 2018
Filing Date:
August 26, 2014
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L25/07; H01L21/56; H01L25/18
Domestic Patent References:
| JP2014067880A | ||||
| JP2012174747A | ||||
| JP6302627A | ||||
| JP2012147040A | ||||
| JP6295962A | ||||
| JP9045843A | ||||
| JP2011082323A | ||||
| JP2005136332A |
Foreign References:
| WO2011121756A1 |
Attorney, Agent or Firm:
Yamato Tsutsui
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji