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Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4303709
Kind Code:
B2
Abstract:

To provide a thin film capacitor in which a leakage current can be decreased and a capacitance value can be increased.

An upper electrode 3 and a lower electrode 1 are made of at least one material selected from metal nitride of TiN, Ti, W, WN, Pt, Ir, and Ru. A capacitance insulating film 2 is made of a material selected from at least one of ZrO2, HfO2, (Zrx, Hf1-x)O2(0y, Ti1-y)O2(0z, Ti1-z)O2(0k, Til, Hfm)O2(0COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Toshihiro Iizuka
Asae Yamamoto
Asami Toda
Shintaro Yamado
Application Number:
JP2005201425A
Publication Date:
July 29, 2009
Filing Date:
July 11, 2005
Export Citation:
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Assignee:
NEC Electronics Corporation
International Classes:
H01L21/8242; H01L27/108; H01L21/822; H01L27/04
Domestic Patent References:
JP2000114492A
JP7161934A
JP2001111000A
JP200012802A
JP2000124424A
JP200054134A
JP11177085A
JP6151751A
JP2001127270A
JP63236335A
JP62159454A
Attorney, Agent or Firm:
Mitsuhiro Hamada