半導体装置の製造方法 - Renesas Electronics Corporation

Title:

半導体装置の製造方法

Document Type and Number:

Japanese Patent JP5147284

Kind Code:

B2

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Inventors:

Toshihiko Tanaka

Application Number:

JP2007126387A

Publication Date:

February 20, 2013

Filing Date:

May 11, 2007

Export Citation:

Assignee:

Renesas Electronics Corporation

International Classes:

H01L21/027; G03F7/20; H01L21/3213; H01L21/768; H01L21/82; H01L21/8238; H01L27/092

Domestic Patent References:

Attorney, Agent or Firm:

Takuji Yamada
Mitsuo Tanaka
Mikio Takeuchi

Previous Patent: JPS5147283

Next Patent: ディスク収納体及びディスク装置