Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5183076
Kind Code:
B2
Abstract:
To provide an adhesive composition providing a cured product having excellent properties for filling a substrate having a fine circuit, laminate properties at low temperature, low modulus, adhesiveness and heat resistance; and to provide an adhesive film including the composition, and a method for producing a semiconductor device by using the adhesive film.
The adhesive composition has ≤10,000 Pa s melt viscosity at 40-80°C, and 100-10,000 Pa s melt viscosity at 100-(T+30)°C after heating the composition at 80-(T+50)°C for 1 min to 2 hr (with the proviso that T is a hardening-starting temperature of the composition).
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
Nobuhiro Ichiroku
Shohei Kosakai
Shohei Kosakai
Application Number:
JP2007030208A
Publication Date:
April 17, 2013
Filing Date:
February 09, 2007
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L21/52; C09J7/02; C09J11/04; C09J163/00; C09J179/08; C09J183/10
Domestic Patent References:
| JP2004319823A | ||||
| JP2005120269A | ||||
| JP2006005159A | ||||
| JP2005120270A |
Attorney, Agent or Firm:
Mamoru Ushiki
Michiko Shinoda
Shimizu Sakaematsu
Kuniaki Toyama
Moriya Kataka
Takuya Yano
Tomoyuki Takahashi
Junji Tanaka
Michiko Shinoda
Shimizu Sakaematsu
Kuniaki Toyama
Moriya Kataka
Takuya Yano
Tomoyuki Takahashi
Junji Tanaka