To easily and accurately position the angle of a plate-like structure pattern used as a mask, to a (111) face of a semiconductor substrate wafer.
In this method of manufacturing a semiconductor structure, the semiconductor substrate wafer is wet-etched to form the plate-like structure with the side faces formed as the (111) faces almost perpendicular to the main surface of the semiconductor substrate wafer. The orientation flat faces of the semiconductor substrate wafer are formed as the (111) faces, and a wet etching mask is formed aligned to be parallel with the orientation flat faces as a basis to form the plate-like structure. Or (111) face detecting patterns are provided at least at two parts on the semiconductor substrate wafer, and after detecting the (111) faces, the (111) face detecting patterns coinciding with the (111) faces are set as an alignment reference. The formed plate-like structure is used as a mirror in an optical switching device.
OKA NAOMASA
SUZUKI YUJI
YOSHIHARA TAKAAKI
NOGE HIROSHI
OGIWARA ATSUSHI
USHIYAMA NAOKI
HARADA HIROSHI
KONO KIYOHIKO
Nakamura Tomoyuki
Shunichi Takahashi
Suzuki Isobe
Yuko Ito