Title:
構造体、配線基板および配線基板の製造方法
Document Type and Number:
Japanese Patent JP5725013
Kind Code:
B2
Inventors:
Naoki Kobayashi
Hiroshi Toriyao
Tokuaki Ando
Hiroshi Toriyao
Tokuaki Ando
Application Number:
JP2012504292A
Publication Date:
May 27, 2015
Filing Date:
February 07, 2011
Export Citation:
Assignee:
NEC
International Classes:
H01P1/00; H01Q15/14; H05K3/46
Domestic Patent References:
| JP2009021594A | 2009-01-29 | |||
| JP2008277755A | 2008-11-13 | |||
| JP2009021594A | 2009-01-29 |
Foreign References:
| WO2008054324A1 | 2008-05-08 | |||
| WO2008054324A1 | 2008-05-08 |
Attorney, Agent or Firm:
Shinji Hayami