Title:
基板処理装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JPWO2013146118
Kind Code:
A
Inventors:
South Kaichiro
Brook 雲龍
Norinobu Akao
Shinji Yashima
Ayafumi Umekawa
Masahisa Okuno
Constant rice field Takuya
Brook 雲龍
Norinobu Akao
Shinji Yashima
Ayafumi Umekawa
Masahisa Okuno
Constant rice field Takuya
Application Number:
JP2013055961W
Publication Date:
December 10, 2015
Filing Date:
March 05, 2013
Export Citation:
Assignee:
Hitachi Kokusai Electric, Inc.
International Classes:
H01L29/78; H01L21/336; H01L21/316; H01L21/31; H05B6/68