Title:
配線基板、半導体装置及び配線基板の製造方法
Document Type and Number:
Japanese Patent JP5753471
Kind Code:
B2
Abstract:
A wiring board includes a resin substrate in which reinforcement members are arranged horizontally, a through electrode filled in a through hole penetrating the substrate in a thickness direction, and wiring layers respectively formed on both surfaces of the substrate and electrically connected to each other via the through electrode. The reinforcement members are arranged such that reinforcement members arranged in a middle region of the substrate in the thickness direction has higher density than reinforcement members arranged in the regions other than the middle region of the substrate.
Inventors:
Satoshi Fujii
Application Number:
JP2011225062A
Publication Date:
July 22, 2015
Filing Date:
October 12, 2011
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K3/46; H01L23/14; H05K1/03; H05K1/11; H05K3/40; H05K3/42
Domestic Patent References:
| JP2007149870A |
Foreign References:
| WO2010076875A1 |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda