Title:
MANUFACTURING METHOD FOR WIRING BOARD
Document Type and Number:
Japanese Patent JP2002141662
Kind Code:
A
Abstract:
To provide a manufacturing method for a wiring board which improve insulation reliability and insulating film characteristics and form fine wires.
The adhesive strength between an insulating film and a wire is improved by uniformly layering fine powder of copper in the surface of an insulating film to obtain stable adhering power.
Inventors:
YOSHIZAWA CHIE
KITAMURA NAOYA
YAMAGUCHI YOSHIHIDE
KASHIMURA TAKASHI
SHIGI HIDETAKA
WATABE MAKIO
KYOI MASAYUKI
NAKAYAMA HIROTAKE
KITAMURA NAOYA
YAMAGUCHI YOSHIHIDE
KASHIMURA TAKASHI
SHIGI HIDETAKA
WATABE MAKIO
KYOI MASAYUKI
NAKAYAMA HIROTAKE
Application Number:
JP2000340376A
Publication Date:
May 17, 2002
Filing Date:
November 02, 2000
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Sakuta Yasuo
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