To effectively control for optimum squeegee pressing of substrate mounting cream solder printing.

As a part of a cream solder printing mask for a product substrate or as another mask 1, both a small pattern part 2 having pitch and width respectively smaller than the minimum pitch and the minimum width of a pattern for soldering parts on the product substrate and a large pattern part 4 having pitch and width respectively larger than the maximum pitch and the maximum width of the pattern for soldering the same parts are provided. Trial printing is performed by changing squeegee pressing. A squeegee pressing range is obtained in which good printing quality is obtained together in the large and small both pattern parts 2, 4. Furthermore, squeegee pressing is set in the center of the obtained range or in the vicinity of the center or in a point slightly shifted from the center in the reverse direction for the deterioration direction corresponding to the following use and cream solder printing is practically performed. Thereby, the best printing quality is obtained in the conditions at a point of time thereof regardless of a factor such as hardness, the shape and he angle of the squeegee and the kind of cream solder.