Title:
マッサージ装置
Document Type and Number:
Japanese Patent JP7001269
Kind Code:
B2
Abstract:
A massaging apparatus minimizes the application of an excessive load to a massage target area of user's body from a massaging element firmly pressed into contact with the massage target area, provides satisfactory massage treatment, and distributes an excessive load imposed on the massaging element to protect the massaging apparatus itself from damage such as breakage. The massaging apparatus includes a massaging element for performing massage treatment on a massage target area of user's body, and an arm member provided at its head with the massaging element. The arm member has load-reducing mechanism for absorbing a load applied to the arm member from the massaging element. The load-reducing mechanism absorbs a load imposed on the massaging element by exploiting an urgence exerted in a front-rear direction.
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Inventors:
Koji Taguchi
Tetsuya Ishikawa
Shimizu new plan
Tetsuya Ishikawa
Shimizu new plan
Application Number:
JP2018153594A
Publication Date:
February 03, 2022
Filing Date:
August 17, 2018
Export Citation:
Assignee:
Daito Electric Industry Co., Ltd.
International Classes:
A61H7/00
Domestic Patent References:
| JP49142993U | ||||
| JP2018102794A |
Attorney, Agent or Firm:
Mikio Yasuda