To produce a material suitable for electric and electronic parts, especially, lead material or contact material, which is excellent in resistance to heat and surface oxidation and which exhibits little deterioration in the jointing strength at the jointing part when it is jointed with a solder, and to provide the electric and electronic parts using the material.
This material is constituted of a substrate 1 wherein at least surface layer consists of Cu or Cu alloy, an intermediate layer 2 having a Cu3Sn ( phase) layer 2a which is laminated on the substrate 1 and a Cu6Sn5 (η' phase) layer 2b which is laminated on the Cu3Sn layer 2a, and a surface layer 3 which is formed on the intermediate layer 2 and consists of a Sn-layer or Sn-containing alloy layer containing Ag3Sn ( phase) compound and having a thickness of 0.5-20 μm. The material is produced by electrically plating the substrate wherein at least surface layer consists of Cu or Cu alloy in a Sn plating bath or in a Sn alloy plating bath containing Ag ion in an amount 0.2-10,000 ppm.
TANIMOTO MORIMASA
TANAKA HITOSHI
