Title:
MATERIAL FOR RELAXATION OF THERMAL EXPANSION
Document Type and Number:
Japanese Patent JPS5277586
Kind Code:
A
Abstract:
PURPOSE: To relax thermal expansion effectively by putting plural layers which is consisted of powder material more than two kinds where grain size or its distribution is different between Si diode or copper lead piece.
Inventors:
SOTODANI SHIGEO
SANKI SADAHIKO
DEIITORITSUHI EERUSHIYUREEGERU
SANKI SADAHIKO
DEIITORITSUHI EERUSHIYUREEGERU
Application Number:
JP15434075A
Publication Date:
June 30, 1977
Filing Date:
December 23, 1975
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
B22F5/00; B32B15/00; H01L21/52; H01L23/12; H01L23/48; (IPC1-7): B23K19/00; B32B15/00; H01L23/12; H01L23/48
Domestic Patent References:
| JP37017727A | ||||
| JP38001272A |