Title:
MATRIX MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JPH04332189
Kind Code:
A
Abstract:
PURPOSE: To provide a matrix mounting method which does not require link wirings or enables to reduce link wiring regions in order to prevent high wiring density of the mother substrate, particular of the part where the primary switch (circuit) and the secondary switch (circuit) are provided adjacently.
CONSTITUTION: A first substrate group PCB 1 mounting a first circuit and a second substrate group PCB 2 mounting a second circuit are provided face to face with each other and arranged in such a direction crossing with each other. These substrate groups are connected via the crossing point.
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Inventors:
HAMASATO KAZUO
FUKUDA HARUYUKI
ISHIZAWA AKIRA
FUKUDA HARUYUKI
ISHIZAWA AKIRA
Application Number:
JP13023791A
Publication Date:
November 19, 1992
Filing Date:
May 07, 1991
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
H01H13/76; H05K1/02; H05K1/14; (IPC1-7): H01H13/76; H05K1/02; H05K1/14
Attorney, Agent or Firm:
Namiki Akio