To realize the manual mounting of a component to be connected without lifting and tilting by mounting the component with suppressed dispersion of solder quantity by adopting a simple structure to consequently mount the component at an identical planar height.

The mechanism for connection to a printed wiring board comprises land patterns 2a for electrically connecting a component 4 to be connected to desired wiring patterns 2, and an insulating cover 3 which covers the land patterns with an insulator and which has a plurality of openings 3b, 3c for exposing parts of the regions of the land patterns. Solder bonding portions 4a of the component to be connected are arranged on regions that correspond to the land patterns exposed by the openings 3b of the insulating cover, while cream solder 5 is provided on a region of the land pattern exposed by the other opening 3c where the solder bonding portion is not arranged. The cream solder is melted while additional solder is being fed to electrically connect the solder bonding portions to the land pattern.