PURPOSE: To enable removing of a flat pack, etc., mounted by a bonding material such as solder without damaging the same by combining a nozzle which ejects hot air and a pad which sucks and hangs an object to be removed by an air jet without contact.

CONSTITUTION: Air flow A is ejected from the nozzle 1 or the pad 2 via a heating body 4 in a case 3 to the outside. A device for changing the air flow A changes the air flow A in the direction of the nozzle 1 or the pad 2 as a rod 14 mounted with an upper valve 9 and a lower valve 8 at both ends connected to a knob 10 via a bar 11 is vertically moved by the vertical movement of the knob 10. The nozzle 1 is brought near to the bonding material bonded to the object 13 to be removed and the bonding material is melted by the heated air flow A, by which the object 13 is removed from a substrate. The nozzle 1 is shut off when the air flow A is changed in the direction of the pad 2. The object 13 is then sucked and hung without contact by a drop of static pressure in the pad 2, by which the object is removed from the substrate.