To provide a memory mounting system which can make the route connecting a memory controller and a memory chip to each other ideal and can radiate the heat which increases as the operating speed of the memory chip or memory controller increases and in which the number of memories can be increased easily.

This memory mounting system has connecting terminals on the bottom face of a package, relay terminals on the top face of the package, and a grounding terminal coaxially surrounding the connecting and relay terminals. The number of memories can be increased by piling up packages.