金属-セラミックス接合基板およびその製造方法

Title:

金属-セラミックス接合基板およびその製造方法

Document Type and Number:

Japanese Patent JP4496404

Kind Code:

B2

Abstract:

In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.

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Inventors:

Hideyo Koyamauchi
Takayuki Takahashi
Mutsumi Namioka

Application Number:

JP2003351936A

Publication Date:

July 07, 2010

Filing Date:

October 10, 2003

Export Citation:

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Assignee:

DOWA Metal Tech Co., Ltd.

International Classes:

B22D19/00; C04B37/02; H01L23/15; C23F1/00; C23F1/02; H01L23/14; H01L23/373; H05K1/02; H05K3/20

Domestic Patent References:

JP10189803A
JP2003100938A
JP2003060282A
JP2003063879A
JP8083864A
JP9289266A
JP10180433A

Attorney, Agent or Firm:

Koichi Okawa

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