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Title:
金属-セラミックス接合体
Document Type and Number:
Japanese Patent JP4168114
Kind Code:
B2
Abstract:
There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 mu m and which is 250 mu m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25 % or more of the thickness of the metal plate.

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Inventors:
Nobuyoshi Tsukaguchi
Junji Nakamura
Masahiko Wada
Mutsumi Namioka
Kimura Masami
Application Number:
JP2001304277A
Publication Date:
October 22, 2008
Filing Date:
September 28, 2001
Export Citation:
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Assignee:
DOWA Holdings Co., Ltd.
International Classes:
B23K1/14; B23K1/00; C04B37/02; B23K1/19; C04B35/01; C04B35/10; C04B35/56; C04B35/565; C04B35/58; C04B35/581; C04B35/584; H01L23/12; H05K3/38; B23K35/00; B23K35/28; B23K35/30; B23K103/18; H05K1/03
Domestic Patent References:
JP2001332854A
JP9275165A
JP2001203299A
JP2001089257A
JP2000124585A
Foreign References:
WO1998054761A1
Attorney, Agent or Firm:
Koichi Okawa



 
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