Title:
METAL-CLAD LAMINATE AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2022111167
Kind Code:
A
Abstract:
To provide a metal-clad laminate and a circuit board which are capable of reducing transmission loss even in high-frequency transmission and are excellent in dimensional stability.SOLUTION: A metal-clad laminate (C) includes: a first single-sided metal-clad laminate (C1); a second single-sided metal-clad laminate (C2); and an adhesive layer (B) which is laminated between the first single-sided metal-clad laminate (C1) and the second single-sided metal-clad laminate (C2) and has a dielectric loss tangent at a frequency of 10 GHz measured using an SPDR dielectric resonator of 0.004 or less. When the total thickness of a first insulating resin layer (P1), the adhesive layer (B) and a second insulating resin layer (P2) is T1, the ratio (T2/T1) of the thickness T2 of the adhesive layer (B) is within the range of 0.5-0.96. In the adhesive layer (B), a resin component comprises a thermoplastic polyimide containing a tetracarboxylic acid residue and a diamine residue, and the storage modulus at 250°C is 5×107 Pa or less.SELECTED DRAWING: Figure 1
Inventors:
ANDO TOMONORI
NISHIYAMA TEPPEI
NISHIYAMA TEPPEI
Application Number:
JP2022086224A
Publication Date:
July 29, 2022
Filing Date:
May 26, 2022
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD
International Classes:
B32B15/088; B32B15/08; H05K1/03
Domestic Patent References:
| JP2018170417A | 2018-11-01 |
Attorney, Agent or Firm:
Kazuhiro Watanabe
Noboru Tajime
Taeko rice Keiko
Taji U.S. Patent Office
Noboru Tajime
Taeko rice Keiko
Taji U.S. Patent Office
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