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Title:
金属コロイド粒子及びそのペースト並びにその製造方法
Document Type and Number:
Japanese Patent JP5661273
Kind Code:
B2
Abstract:

To obtain metal colloid particles containing metal nanoparticles, which allows a highly electrically conductive and hard film to be formed by a simple method even if calcined at low temperature.

In the metal colloid particles containing metal nanoparticles (A) and a dispersant (B), the metal nanoparticles (A) contains metal nanoparticles whose number-average particle size is ≤50 nm and the particle size is 100-200 nm. The metal nanoparticles (A) are composed of metal nanoparticles (A1) having a particle size of <100 nm and metal nanoparticles (A2) having a particle size of 100-200 nm, wherein the volume ratio of the former/the latter is 90/10 to 30/70. The metal constituting the metal nanoparticles (A) may be silver. The dispersant (B) may be a combination of 1-6C aliphatic carboxylic acids and polymer dispersant. The ratio of the dispersant (B) may be 5 pts.mass or less based on 100 pts.mass of the metal nanoparticles (A). The paste may be prepared with the metal colloid particles and a solvent, and further made to contain metal powders having a number average particle size of ≥200 nm.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
伊勢田 泰助
生武 範子
越智 幸史
巖本 政博
Application Number:
JP2009267433A
Publication Date:
January 28, 2015
Filing Date:
November 25, 2009
Export Citation:
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Assignee:
三ツ星ベルト株式会社
International Classes:
B22F9/00; B01J13/00; B22F1/00; B22F9/24; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Attorney, Agent or Firm:
Atsuo Kuwata
Hiroshi Sakanaka



 
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